期刊文献+

碳化硅材料性能优异,应用迎来发展良机 被引量:2

Silicon carbide material has excellent performance and ushers in a good opportunity for development in the application field
下载PDF
导出
摘要 碳化硅作为第三代半导体材料的代表,有禁带宽度大、击穿电场高、热导率高、电子饱和速率高、抗辐射能力强等特点,由其制成的半导体器件在高温、高压、高频大功率的环境下具备良好的性能表现,被广泛应用于汽车、工业与能源、5G建设等领域。本文介绍了碳化硅产业链及其应用领域和发展前景。 As a representative of the third generation of silicon carbide List of semiconductor materials,silicon carbide is characterized by wide band gap,high breakdown electric field,high thermal conductivity,high electron saturation rate and strong radiation resistance,the semiconductor devices made by SiC have good performance in high temperature,high pressure,high frequency and high power environment,and are widely used in the fields of automobile,industry and energy,5G construction and so on.In this paper,silicon carbide industry chain and its application fields and development prospects are introduced.
作者 刘宇浩 LIU Yu-hao(South University of Science and Technology,Shenzhen-hong Kong Institute of Microelectronics)
出处 《中国集成电路》 2023年第5期16-21,共6页 China lntegrated Circuit
关键词 碳化硅 功率半导体 外延 Silicon Carbide Power semiconductor device epitaxy
  • 相关文献

同被引文献13

引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部