智能卡温度报警问题分析及优化设计

Smart IC card temperature alarm problem analysis and optimization design

随着智能卡芯片集成度越来越高,芯片功率密度不断增大,在部分应用场景中,智能卡出现由于功耗过大导致温度报警,致使芯片停止工作的现象。本研究以实际应用的智能卡为例,通过红外测温实验和数值模拟技术,评估产品的散热性能。从智能卡封装结构设计、塑封胶材料、芯片热源点功率值、热源点面积和芯片面积五方面,评估报警位置的温度值和智能卡表面的温度分布,提出采取特定封装结构、降低热源点功率、增大热源面积可有效解决IC卡由于局部温度过高产生的温度报警问题。

With the increasing integration of smart card chips,the power density of chips continues to increase,which makes IC cards stop working due to excessive power consumption leading to temperature alarms in some application scenarios.In this study,taking the practical smart card as an example,the heat dissipation performance of the product was evaluated by infrared temperature measurement experiment and numerical simulation technology.From the five aspects of smart card packaging structure design,plastic sealing material,chip heat source point power value,heat source point area and chip area,the temperature value of the alarm location and the temperature distribution of the smart card surface are evaluated,and it is proposed that adopting a specific package structure,reducing the power of the heat source point,and increasing the heat source area can effectively solve the temperature alarm problem caused by the excessive local temperature of the IC card.