晶体倒角工艺改进方法研究

Study on Improvement Method of Crystal Chamfering Process

针对非标准尺寸的晶块和晶圆在倒角过程中存在崩边、崩缺等问题,该文通过设计并排式组合夹具和真空吸附盘组件将产品固定,同时设计45°和弧形刀具,然后采用单一直线和正偏移路径进行加工。实验结果表明,与传统的倒角工艺相比,优化能大幅度地降低倒角过程中产生的崩边、崩缺等问题,不合格率从14.78%降低到3.09%,有利于批量生产。

To address the problems of edge collapse and crashing in the chamfering process of non-standard crystal bulk and wafers,the side by side modular fixtures and vacuum adsorption disk components are designed to fix the product,and the 45°and arc cutters are designed,and then the single straight line and positive offset path are used for processing.The experimental results show that compared with the traditional chamfering process,the optimized process can greatly reduce the edge collapse and crashing during the chamfering process,and the unqualified rate is reduced from 14.78%to 3.09%,which is beneficial for batch production.