摘要
描述了一种宽带低相噪梳谱SiP的设计思路和问题分析。综合运用电路、热、力学等多维度物理量仿真和工程分析,在RF类产品不断小型化的趋势下,不断探索和开拓设计边界。高密度梳谱Si P的技术指标达到课题的技术要求,已大量应用于工程课题。
The design idea and problem analysis of a comb spectrum SiP with broadband low phase noise are described.By integrated utilizing multi-dimensional physical simulation and engineering analysis such as circuit,thermodynamics,mechanics,the design boundaries are continuously explored and expanded in the trend of miniaturization of RF products.The technical indexes of high density comb spectrum SiP meet the technical requirements of the project and have been applied in many other projects.
作者
王燕
WANG Yan(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2023年第3期6-8,31,共4页
Electronics Process Technology
关键词
低相噪
梳谱
SIP
low phase noise
comb spectrum
system in package
