某军用产品SMT锡膏印刷质量控制与实现

Quality Control and Realization of SMT Solder Paste Printing for a Certain Military Product

表面组装技术(SMT)是目前电子组装行业中最流行的一种技术和工艺,自20世纪70年代初推向市场以来,逐渐成为现代电子组装产业的主流。SMT的核心工艺能力建设主要是指SMT的装联工艺过程,因此要想获得良好的产品质量、做到无缺陷的大批量生产,应谋求SMT装联工艺过程的最佳化。锡膏印刷是SMT生产线的第一道工序,直接影响后续贴片、回流焊、清洗、测试等工艺过程,以及标准表贴器件组装的质量和效率。对其实施过程进行工艺控制,使产品采用最佳的生产工艺,从而保证电子产品的最终质量与使用可靠性。以DEK HORIZON 8型全自动丝网印刷机为硬件基础,结合某军用产品4类PCBA的特点,通过合理的验证试验与过程控制,对锡膏印刷工艺参数进行研究,以实现产品高质量生产。

The surface mounted technology(SMT)was one of the most popular technologies and processes in the electronic assembly industry.Since it was introduced to the market in the early 1970s,it has been gradually become the mainstream of modern electronic assembly industry.The core technological capacity building of SMT mainly referred to the SMT mounting process.Therefore,in order to achieve good product quality and mass production without defects,the optimization of SMT mounting process should be sought.The solder paste printing was the first process of the SMT production line,which had a direct impact on subsequent processes,such as patch,reflow,cleaning and testing and so on,and also affected the quality and efficiency of the assembly of standard table-mount devices.The implementation of the process control made that the products in production had the best producing process,so as to ensure the SMT product final quality and the using reliability.Based on DEK HORIZON 8 automatic printer and combined with the characteristics of the fourth PCBA of a certain military product,it was studied that the parameters of solder paste printing by reasonable verification test and process control,so as to achieve high-quality production.