期刊文献+

基于3D打印的太赫兹波导成型技术研究

下载PDF
导出
摘要 为提高太赫兹波导结构设计质量,保证多个波导机械连接获得良好的传输性能,现提出一套太赫兹波导3D打印制备方案。首先,介绍太赫兹时域光谱系统。其次,从光固化成型技术原理、RSpro600打印机及其成型材料、光敏树脂的材料参数表征等方面入手,利用光固化成型技术,完成对太赫兹波导的制备。最后,从波导制备、实验分析2个方面入手,分析空芯微波布拉格波导的3D打印结果。结果表明,运用光固化成型技术所制备的太赫兹波导具有结构完整、传输性能稳定、其频谱始终维持在0.29~0.48 THz之间,其光谱能量损耗相对较低,远远低于常规支撑结构的波导。希望通过这次研究,为相关人员提供有效的借鉴和参考。 In order to improve the design quality of terahertz waveguide structure and ensure the good transmission performance of mechanical connections of multiple terahertz waveguides,a set of terahertz waveguide 3D printing preparation scheme is proposed.First of all,the terahertz time domain spectroscopy system is introduced.Secondly,starting from the principle of UV-curing technology,RSpro600 printer and its molding materials,and the characterization of material parameters of photosensitive resin,the terahertz waveguide is fabricated by using UV-curing technology.Finally,the 3D printing results of hollow microwave Bragg waveguides are analyzed from two aspects of waveguide preparation and experimental analysis.The results show that the terahertz waveguide fabricated by UV-curing technology has complete structure,stable transmission performance,its frequency spectrum is always maintained between 0.29~0.48 THz,and its spectral energy loss is relatively low,which is much lower than that of conventional supported waveguides.It is hoped that through this study,for the relevant personnel to provide effective reference.
作者 白改艳
出处 《科技创新与应用》 2023年第16期58-61,共4页 Technology Innovation and Application
关键词 太赫兹(THz)波导 3D打印 成型技术 传输 支撑 terahertz(THz)waveguide 3D printing forming technology transmission brace
  • 相关文献

参考文献12

二级参考文献92

  • 1杨明波,杨敏,卢建立.Muller法的一种改进方法[J].河南师范大学学报(自然科学版),2007,35(4):38-40. 被引量:14
  • 2Peter H S 2002 IEEE Trans. Microwave. Theory Tech. 50 910.
  • 3John H B 2008 Phys. Plasmas 15 055502.
  • 4Shin Y M, Larry R B, Neville C L 2009 IEEE Trans. Electron Dev. 56 3196.
  • 5Shin Y M, Baig A, Larry R B, Tsai W C, Neville C L 2012 IEEE Trans. Electron Dev. 59 234.
  • 6Baig A, Gamzina D, Barchfeld R, Domier C, Barnett L R, Neville C L 2012 Phys. Plasmas 19 093110.
  • 7Field M, Griffith Z, Young A, Hillman C, Brar B 2014 15th IEEE International Vacuum Electronics Confer- ence Monterey, USA, April 22-24, 2014 p225.
  • 8Kory C L, Read M, Ives R L 2009 IEEE Trans. Electron Dev. 56 713.
  • 9Comfoltey E N, Shapiro M, Sirigiri J, Temkin R 2009 10th IEEE International Vacuum Electronics Confer- ence Rome, Italy, April 28-30, 2009 p127.
  • 10Tucek J C, Basten M A, Gallagher D A, Kreischer K E 2010 11th IEEE International Vacuum Electronics Con- ference Monterey, USA, May 18-20, 2010 p19.

共引文献27

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部