摘要
Cu-Zr合金主要应用于电子信息领域,是集成电路引线框架的关键材料。本文总结了Cu-Zr二元合金、Cu-Ag-Zr合金、Cu-Cr-Zr合金等的组织、性能与研究进展,介绍了其主要强化机制,阐述了铜锆合金的主要加工工艺及其对合金性能的影响,并在此基础上对铜锆合金的未来发展方向进行了展望。
Cu-Zr alloy is mainly used in the field of electronic information and is the key material of integrated circuits lead frame.This paper summarizes the microstructure,properties and research progress of Cu-Zr binary alloy,Cu-Ag-Zr alloy,Cu-Cr-Zr alloy,introduces their main strengthening mechanisms,expounds the main processing technologies of the Cu-Zr alloy and their effects on the properties of the alloy,and on this basis,prospects the future development direction of the Cu-Zr alloy.
作者
曹军
苏成豪
CAO Jun;SU Cheng-hao(School of Mechanical and Power Engineering,Henan Polytechnic University,Jiaozuo 454003,China)
出处
《材料热处理学报》
CAS
CSCD
北大核心
2023年第5期16-24,共9页
Transactions of Materials and Heat Treatment
基金
区域创新发展联合基金重点项目(U21A2051)。
关键词
铜合金
高强度合金
铜锆化合物
稀土
微合金化
copper alloy
high strength alloy
Cu-Zr compound
rare earth
microalloying
