摘要
功率芯片kW/cm^(2)量级的热流密度给其热管理带来了严峻挑战,液冷微流道散热技术是解决热管理问题的重要研究方向。针对陶瓷封装中的应用需求,对高温共烧陶瓷(HTCC)中微流道工艺特性进行了研究。通过微流道设计、工艺流程设计、制备加工和测试,分析了结构参数对加工质量的影响,明确了微流道与芯片之间的陶瓷体厚度为0.30 mm,微流道宽度应≥0.10 mm,微流道间距需根据不同微流道宽度进行设计,微流道长度为非敏感要素。选择适当的结构参数可保证微流道的成形质量和加工精度,为微流道设计和工程化应用提供参考。
The heat flux density scale of kW/cm’of power chip brings serious challenges to its thermal management,and the liquid cooling micro-channel heat dissipation technology is an important research direction to solve the problem of thermal management.To meet the application requirements of ceramic packaging,the process characteristics of high temperature co-fired ceramic(HTCC)with microchannels were studied.Through micro-channels design,process design,preparation processing and testing,the influence of structural parameters on processing quality was analyzed.Some conclusions are clarified,such as the ceramic thickness between micro-channels and chip is 0.30 mm,the microchannels width should be≥0.10 mm,the spacing between multiple micro-channels should be desingned according to different micro-channel widths,and the micro-channels length is a non-sensitive factor.The values of these structural parameters can ensure the forming quality and processing accuracy of the micro-channels.The research results can provide reference for micro-channel design and engineering application.
作者
彭博
高岭
刘林杰
淦作腾
王明阳
杜平安
郑镔
Peng Bo;Gao Ling;Liu Linjie;Gan Zuoteng;Wang Mingyang;Du Ping'an;Zheng Bin(School of Mechanical and Electrical Engineering,University of Electronic Science and Technology of China,Chengdu 610054,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China)
出处
《半导体技术》
CAS
北大核心
2023年第5期443-447,共5页
Semiconductor Technology
基金
国家自然科学基金面上项目(52175218)。
关键词
高温共烧陶瓷(HTCC)
液冷
微流道
工艺
散热
high temperature co-fired ceramic(HTCC)
liquid cooling
micro-channel
process
heat dissipation
