摘要
综述了钢铁基体表面焦磷酸盐体系、酸性硫酸盐体系、EDTA(乙二胺四乙酸)体系、HEDP(羟基乙叉二膦酸)体系等无氰镀铜工艺的研究进展,为今后的研究方向提出建议。
The research progress of cyanide-free copper plating for steel substrates in pyrophosphate-based bath,acid sulfate-based bath,EDTA(ethylenediaminetetraacetic acid)-based bath,HEDP(1-hydroxyethylidene-1,1-diphosphonic acid)-based bath,and etc.were reviewed.Some advices on future research directions in this field were given.
作者
王建鹏
张馥
曹鹏
石磊
康昆勇
罗来喜
WANG Jianpeng;ZHANG Fu;CAO Peng;SHI Lei;KANG Kunyong;LUO Laixi(Collage of Materials and Chemical Engineering,Southwest Forestry University,Kunming 650224,China;Department of Biochemical Engineering,Chaoyang Teachers College,Chaoyang 122000,China;School of Materials science and Engineering,Shandong Jianzhu University,Ji’nan 250101,China)
出处
《电镀与涂饰》
CAS
北大核心
2023年第11期16-22,共7页
Electroplating & Finishing
基金
山东省自然科学基金量子联合基金项目(ZR202108100033)
山东省科技型中小企业创新能力提升工程(2022TSGC2561)。
关键词
无氰镀铜
钢铁
配位剂
综述
cyanide-free copper plating
steel
complexing agent
review
