中国早期印制电路板生产技术回顾(4)——典型工艺(下)

Review of early PCB production technologies in China Part(4)--Typical process(2)

对中国早期印制电路板(PCB)生产技术进行了回顾。本期介绍一些早期PCB工艺技术,主要是PCB的钻孔与成形、多层压制、电镀涂覆等工艺及设备条件。供读者参详。

This paper introduces some early PCB technologies,mainly the process and equipment conditions of PCB drilling and forming,multilayer pressing,electroplating and final finishing.