PCB巨量超微小焊盘关键技术

Research of key technologies of large number and ultra-small pads for PCB

发光二极管(LED)是一种把电能转化为光能的半导体二极管。Mini-LED芯片尺寸最长边为50~200μm,而Micro-LED芯片尺寸最长边则<50μm,它们分别可实现像素点距离0.5~1.0 mm及0.5 mm以下的产品。研究Mini-LED所用的超微小巨量焊盘印制电路板(PCB),包括Mini-LED巨量焊盘PCB设计与优化、Mini-LED PCB板厚控制、超微小巨量焊盘制作、Mini-LED PCB微小阻焊开窗与油墨平整等技术。

LED(light emitting diode)is a kind of semiconductor diode which can convert electric energy into light energy.The longest edge of the Mini-LED chip is 50-200μm,while the longest edge of the micro-LED chip is less than 50μm.It can respectively realize the pixel point distance P0.5mm-1.0mm and P0.5mm below the product.This project studies micro-micro and large-size pad PCB products for Mini-LED display.The key points are the design and optimization of micro-LED large-size pad PCB,the control technology of Mini-L ED PCB board thickness,the research of micro-micro and large-size pad technology,the micro-solder window opening and ink leveling technology of Mini-LED PCB.