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高密度互连板多张芯板防叠错方法

Discussion on the method of preventing HDI board multiple core plates from stacking in wrong order
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摘要 随着电子产品不断向小型化、多功能化、高速化方向发展,高密度互连(HDI)印制电路板(PCB)所用芯板层次也越来越多,预防HDI板多张芯板层次顺序叠错并进行有效控制,成为HDI板制程控制的关键。通过资料设计,利用目视检查、自动光学检查、设备扫码、附连测试板等过程检测管控方法,可以有效避免HDI多张芯板层次顺序叠错以及流出。该方法可为做好HDI板制程放叠错提供参考。 With the continuous development of electronic products in the direction of miniaturization,multi-function and high-speed,more and more layers of core boards are used in PCBs.How to prevent the order of HDI multiple core boards from being misplaced and effectively controlled has become the key element of HDI process control.Through data design and the use of process inspection and control methods such as visual inspection,automatic optical inspection,equipment scanning,and attached test boards,it is possible to effectively avoid the stacking and outflow of multiple HDI core boards,providing a reference for the industry to do a good job of HDI boards.
作者 郭达文 孙劼 曾龙 文伟峰 GUO Dawen;SUN Jie;ZENG Long;WEN Weifeng(Jiangxi Redboard Technology Co.,Ltd.,Jian 343100,Jiangxi,China)
出处 《印制电路信息》 2023年第6期31-34,共4页 Printed Circuit Information
关键词 高密度互连(HDI) 多张芯板 防叠错 high density interconnector(HDI) multiple core plate prevent stacking sequence
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