印制电路板导电阳极灯丝失效分析

The case of CAF failure analysis for PCB

随着印制电路板(PCB)向高密度、高频高速化发展,其对可靠性的要求也越来越高。导电阳极丝(CAF)失效作为PCB可靠性的一个重要因素,成为了行业的关注要点。通过实际案例寻找CAF失效点,采用失效区域定位、外观检查、切片分析、扫描电子显微镜(SEM)及能谱(EDS)分析等手段,分析CAF失效原因,并从生产工艺及材料两方面入手,帮助PCB制造商和材料商改进CAF工艺。

With the high-density,high-frequency and high-speed development of printed circuit boards(PCB),the requirements for reliability are getting higher and higher,and conductive anodic filament(CAF)failure,as one of the important factors,has also become the focus of the industry.This article uses practical cases to introduce how to find failure points,and analyzes the failure reasons of CAF by means of failure area location,appearance inspection,slice analysis and SEM and EDS analysis,so as to help PCB manufacturers and material suppliers improve their processes.In this case,the failure reasons were analyzed from two aspects:the production process was mainly caused by unclean etching,and the material was because the surface of the substrate was bonded with a single water molecule layer.