基于冲击响应谱的红外探测器引线键合研究

Wire Bonding of Infrared Detector Based on Shock Response Spectrum

制冷型红外探测器有响应快、灵敏度高和探测距离远的特点,在智能光电装备中应用广泛。然而在实际应用场景中会经历冲击激励,引起冲击响应,为了确保制冷型红外探测器能够胜任复杂多变的苛刻环境,在设计阶段进行冲击响应谱环境适应性研究十分必要。基于应用的动力学环境,通过计算与仿真键合引线弧形受力与位移,综合考虑引线材料特性,优选设计引线材料与键合弧形,并对引线键合工艺进行优化,最终通过了1000g量级的冲击响应谱试验。

Cooled infrared detectors are widely used in the fields of intelligent optoelectronic equipment because of their fast response,high sensitivity,and wide range of detectors.However,the shock response will be caused by impact excitation in practical application scenarios.To ensure competency of a cooled infrared detector in a variety of complex and changeable harsh environments,it is necessary to study the adaptability of the shock response spectrum environment in the design stage.Based on the dynamics environment in the application,the loop force and displacement of the wire were analyzed through calculation and simulation,and the characteristics of materials were considered.The bonding wire materials and bonding wire loop were designed,wire bonding process was optimized,and finally,they passed the test of a shock response spectrum of 1000g.