摘要
Material removal in the cutting process is regarded as a friction system with multiple input and output variables.The complexity of the cutting friction system is caused by the extreme conditions existing on the tool–chip and tool–workpiece interfaces.The critical issue is significant to use knowledge of cutting friction behaviors to guide researchers and industrial manufacturing engineers in designing rational cutting processes to reduce tool wear and improve surface quality.This review focuses on the state of the art of research on friction behaviors in cutting procedures as well as future perspectives.First,the cutting friction phenomena under extreme conditions,such as high temperature,large strain/strain rates,sticking–sliding contact states,and diverse cutting conditions are analyzed.Second,the theoretical models of cutting friction behaviors and the application of simulation technology are discussed.Third,the factors that affect friction behaviors are analyzed,including material matching,cutting parameters,lubrication/cooling conditions,micro/nano surface textures,and tool coatings.Then,the consequences of the cutting friction phenomena,including tool wear patterns,tool life,chip formation,and the machined surface are analyzed.Finally,the research limitations and future work for cutting friction behaviors are discussed.This review contributes to the understanding of cutting friction behaviors and the development of high-quality cutting technology.
基金
financial support from the National Key Research and Development Program of China (2019YFB2005401)
National Natural Science Foundation of China (Nos. 91860207 and 52175420)
Shandong Provincial Key Research and Development Program (Major Scientific and Technological Innovation Project)(No. 2020CXGC010204)
Shandong Provincial Natural Science Foundation of China (2021JMRH0301 and2021JMRH0304)
Taishan Scholar Foundation
International Partnership Scheme of the Bureau of the International Scientific Cooperation of the Chinese Academy of Sciences(No. 181722KYSB20180015)
Research and Innovation Office of The Hong Kong Polytechnic University (BBX5and BBX7)
funding support to the State Key Laboratories in Hong Kong