可紫外光固化含氟聚酰亚胺树脂的合成与性能研究

Synthesis and properties of UV curable fluorinated polyimide resin

以3,5-二氨基苯甲酸(DABA)和可提高溶解性能的六氟二酐(6FDA)作为单体,通过分子结构设计在主链上接枝光敏基团,合成可低温紫外光固化的光敏性聚酰亚胺(PSPI)。探究光敏性聚酰亚胺的基本性能,确定含氟聚酰亚胺树脂的光固化工艺参数,并分析不同配方下薄膜的机械性能和热性能。研究结果表明,以35%(质量分数)的PSPI作为预聚体,20%(质量分数)的丙烯酸羟乙酯(HEA)作为活性稀释剂合成的聚酰亚胺薄膜拉伸强度最高可达(60.71±0.68) MPa,硬度最高可达到(143.5±1.34) MPa,断裂伸长率为(2.83±1.05)%,弹性模量为(3.13±0.21) GPa,薄膜刚性明显提升,同时,在质量损失5%(T_(d5))和10%(T_(d10))时的温度分别为140℃和216℃。

Using 3,5-diaminobenzoic acid and 4,4'-(Hexafluoroisopropylidene) diphthalic anhydride,which can improve solubility,as monomer,by grafting photosensitive groups on the main chain through molecular structure design,a photosensitive polyimide that can be cured at low temperature with UV-lighting was synthesized.The basic properties of the photosensitive polyimide were explored,the photo-curing process parameters of the fluorine-containing polyimide resin were determined,and the mechanical and thermal properties of the film with different formulations were analyzed.The results show that the tensile strength of the polyimide film with 35%(mass fraction) photosensitive polyimide as prepolymer and 20%(mass fraction) hydroxyethyl acrylate as reactive diluent reaches the highest tensile strength of(60.71±0.68) MPa,the highest hardness is(143.5±1.34) MPa,and the tensile elongation is(2.83±1.05)%,the elastic modulus is(3.13±0.21) GPa,the rigidity of the film is obviously improved,and the temperatures at 5%(T_(d5)) and 10%(T_(d10)) thermal mass loss are 140 ℃ and 216 ℃,respectively.