摘要
网络变压器进行回流焊时往往伴随着产品开裂现象产生,本文结合材料膨胀特性以及吸潮特性等方面对开裂现象进行了理论分析。通过进行工艺方面的研究与验证,得出产品回流焊合格率可以通过调整灌封胶配比以及试验前增加烘烤等方面进行改善和提高。
The network transformer reflow soldering is often accompanied by product cracking phenomenon.In this paper,the cracking phenomenon is analyzed theoretically from the aspects of material expansion characteristics and moisture absorption characteristics.Through the process research and verification,it is concluded that the qualified rate of reflow soldering can be improved by adjusting the ratio of potting glue and increasing baking before the test.
作者
孙永生
赵炎奇
王帅博
刘飞南
冯萃峰
许晓东
庞丽红
SUN Yong-sheng;ZHAO Yan-qi;WANG Shuai-bo;LIU Fei-nan;FENG Cui-feng;XU Xiao-dong;PANG Li-hong(Aerospace Internet of Things Technology Co.,Ltd.,Beijing 100094,China)
出处
《机电元件》
2023年第3期44-46,60,共4页
Electromechanical Components
关键词
网络变压器
回流焊
开裂
膨胀特性
吸潮特性
灌封胶配比
烘烤
network transformer
reflow soldering
cracking
expansion characteristics
moisture absorption characteristics
the ratio of potting rubber
baking