Fe-3%Si-Cu取向电工钢热轧及常化组织与织构

Microstructure and texture in hot-rolled and normalized plates of Fe-3%Si-Cu grain-oriented electrical steel

以Cu粒子为单一抑制剂的新型取向电工钢能降低板坯加热温度以及避免长时间高温退火,具有节约能源、降低成本等优势。以Fe-3%Si-Cu取向电工钢为研究对象,研究了Cu粒子为单一抑制剂时对其热轧板及常化板的显微组织、织构及析出相的影响。结果表明,Fe-3%Si-Cu取向电工钢热轧及常化板均有明显的显微组织分布不均匀,表面脱碳层分布宽度由热轧板的311.7μm增加到常化板的427.3μm,平均晶粒尺寸由热轧板的20.2μm增加到26.3μm,织构分布以{110}<112>、{112}<111>、{110}<001>及{114}<418>为主;次表层为等轴晶和变形晶粒混合组织,Goss织构主要分布在表层及次表层,热轧板常化后Goss织构组分减小;中心层主要为变形晶粒,织构分布以{114}<418>、{100}<110>及{100}<001>为主。热轧板中存在尺寸为10~40 nm的Cu粒子,粒子平均直径为23.4 nm,分布面密度为7.30×10^(9)个/cm^(2),常化后Cu粒子分布面密度增加到1.26×10^(10)个/cm^(2),粒子平均直径减小到21.6 nm。

The new oriented electrical steel with Cu particles as a single inhibitor can reduce the heating temperature of slab and avoid long time high temperature annealing,which has the advantages of energy saving and cost reduction.Fe-3%Si-Cu grain-oriented electrical steel was taken as the research object,and the influence of Cu particles as a single inhibitor on the microstructure,texture and precipitation of hot-rolled and normalized plates was studied.The results show that the hot-rolled sheet and normalized plates of Fe-3%Si-Cu oriented electrical steel have obvious microstructure gradients.After normalizing,the distribution width of surface decarbonized layer increased from 311.7μm in hot rolled plate to 427.3μm,the average grain size increased from 20.2μm in hot rolled plate to 26.3μm.The surface decarbonized layer was dominated by{110}<112>,{112}<111>,{110}<001> and{114}<418> textures.The subsurface layer was a mixture of equiaxed and deformed grains,and the Goss texture was mainly distributed in the surface and subsurface layer.After normalizing,the composition of Goss texture was decreased.The central layer was mainly composed of deformed grains,and dominated by{114}<418>,{100}<110> and{100}<001> textures.There are Cu particles with the size of 10-40 nm in the hot rolled plate,the average particle diameter is 23.4 nm,and the distribution surface density is 7.30×10^(9)/cm^(2).After normalizing,the distribution surface density of Cu particles increased to 1.26×10^(10)/cm^(2),and the average particle diameter decreases to 21.6 nm.