摘要
针对微焊点服役下的电迁移可靠性检测,设计制造了满足焊点在理想电迁移环境下的试验装置。结果表明:通过热分解法制备Ni-GNSs增强相,得到的Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头能有效抑制电迁移现象的发生。在电加载条件下,随电流密度升高,Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE/Cu接头阳极区界面金属间化合物(IMC)由起伏扇贝状转变为平坦厚大的板状,并出现了明显Cu 3Sn;阴极区界面IMC由锯齿状转变为薄条状,且有明显空洞裂纹。钎焊接头断裂位置从阴极界面IMC/钎缝的过渡区向阴极界面IMC迁移,断裂方式由韧性断裂向脆性断裂转变,剪切强度明显下降。
For the electromigration reliability detection of micro solder joints in service,a test device was designed and manufactured to meet the ideal electromigration environment of solder joints.The results show that the Ni-GNSs reinforced Sn2.5Ag0.7Cu0.1RE/Cu solder joints obtained by thermal decomposition method can effectively inhibit the electromigration phenomenon.Under the condition of electric loading,as the current density increases the Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu joint anode interface intermetauic compound(IMC)is changed from undulating scallop shape to flat thick plate shape with obvious Cu 3Sn,while the cathode interface IMC is changed from sawtooth shape to thin strip with obvious cavity cracks.The fracture position of the solder joints migrates from the transition zone of the cathode interface IMC/soldering seam to the cathode interface IMC,while the fracture mode changes from ductile fracture to brittle fracture,and the shear strength decreases significantly.
作者
张超
张柯柯
高一杰
王钰茗
ZHANG Chao;ZHANG Keke;GAO Yijie;WANG Yuming(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Provincial and Ministerial Co-construction of Collaborative Innovation Center for Non-ferrous Metal New Materials and Advanced Processing Technology,Henan University of Science and Technology,Luoyang 471023,China)
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2023年第5期1-7,15,M0002,共9页
Journal of Henan University of Science And Technology:Natural Science
基金
国家自然科学基金项目(U1604132)
中原基础研究领军人才(ZYYCYU202012130)。
关键词
Ni-GNSs增强相
无铅钎焊接头
电迁移
界面金属间化合物
力学性能
Ni-GNSs reinforcement phase
lead-free solder joint
electromigration
interfacial intermetallic compounds
mechanical properties
