涂胶显影工艺对线宽均匀性的影响

Effect of Gluing and Developing Process on Line Width Uniformity

随着半导体制造设备的升级、新技术的研发、新材料的引入以及先进制程的控制,“摩尔定律”在集成电路制造领域依旧具有旺盛的生命力。然而,制程工艺的不断提升对半导体制造设备的要求也越来越高。随着CD(Critical Dimension)的不断减小及其均匀性要求的提高,对光刻工艺相关设备的要求也不断提高,着重阐述影响CD均匀性的涂胶显影设备的相关工艺。

With the upgrading of semiconductor manufacturing equipment,the development of new technologies,the introduction of new materials and the control of advanced processes,"Moore's Law"is still very much alive in the field of IC manufacturing.However,the increasing demands on semiconductor manufacturing equipment are also increasing.As the CD(Critical Dimension)decreases and its uniformity increases,so do the requirements for lithography-related equipment,with a focus on the process of coating and developing equipment that affects CD uniformity.