电子元件散热结构的拓扑优化设计

Topology optimization design of heat dissipation structure of electronic components

针对电子元件散热结构优化问题,运用变密度拓扑优化方法,以设计域平均温度最低为目标函数,在流体体积分数为60%,不同Re下对电子元件散热结构进行拓扑优化设计,结果显示,目标函数随Re增大而减小。在Re为1000时得到新型电子元件散热结构,新型散热结构单位时间内流体换热量平均比现有散热结构高34.30%,具有更好的散热性能。

Aiming at the problem of heat dissipation structure optimization of electronic components,the variable density topology optimization method was used and the lowest average temperature in the design domain was taken as the objective function,the topology optimization of the heat dissipation structure of electronic components was designed under the fluid volume fraction of 60%and different Re.The results show that the objective function decreases with the increase of Re.When Re is 1000,the heat dissipation structure of the new electronic components is obtained and 34.30%higher than the existing heat dissipation structure per unit time,which has better heat dissipation performance.