微波毫米波用低介电常数低温共烧陶瓷研究进展

Recent Progress on Low-Permittivity LTCC for Microwave/Millimeter Wave Applications

在新一代高速无线通信技术推动下,低温共烧陶瓷技术(LTCC)正处于重大变革时期.采用低介电常数(K)、低损耗、谐振频率温度稳定型LTCC作为高频基板材料,可以满足无线技术高速率、低延时、高可靠的需求,是当前热点研究之一.因此商用基板材料的现状和一些候选材料的研究工作被主要评述,重点对玻璃/陶瓷体系、氧化物助烧体系、氟化物助烧体系、本征低温烧结体系等低K值LTCC材料的组成、结构特征、介电性能、热膨胀系数等具体指标及相应优缺点进行了讨论.同时介绍了一些热门体系的改性工作及其毫米波适用性,最后对未来低K值LTCC材料的发展进行展望.

With the development of a high-speed wireless technology,low-temperature co-fired ceramics(LTCC)technology becomes popular.The high-speed,low-delay and high-reliable wireless transmission could be achieved by using LTCC substrates with a low-permittivity(K),a low-loss and a stable-temperature of resonant frequency,as one of functional materials.This review introduced the current situation of commercial substrate materials and alternative LTCCs reported,i.e.,ceramic/glass,oxide-assisted sintering,fluoride-assisted sintering and intrinsic low-sintering ceramic systems.The composition,structural characteristics,dielectric properties,coefficient of thermal expansion of low-K LTCCs,as well as the advantages and disadvantages,were also discussed.Some studies of commercial substrates were further described,and their performances in millimeter-wave application were represented.In addition,the development trend of low-K LTCCs was also proposed.