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Sn-20Bi-xCu-yIn焊料在3.5%NaCl溶液中的腐蚀特性

Corrosion characteristics of Sn−20Bi−xCu−yIn solder in 3.5%NaCl solution
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摘要 研究室温条件下Sn-20Bi-xCu-yIn(x=0.3%,0.5%,质量分数;y=1%,2%,3%,质量分数)合金在3.5%(质量分数)NaCl溶液中的腐蚀行为。采用电化学阻抗谱图(EIS)、动电位极化曲线和表面腐蚀产物表征研究焊料的耐腐蚀性能。EIS和极化曲线结果表明,随着In和Cu含量的增加,焊料的耐腐蚀性能降低。采用扫描电镜、能量色散光谱、X射线衍射和X射线光电子能谱对腐蚀产物进行表征。腐蚀产物Sn_(3)O(OH)_(2)Cl_(2)结构松散,不能起到保护作用。Sn-20Bi-0.3Cu-1In的耐腐蚀性能最好。 The corrosion behaviors of Sn−20Bi−xCu−yIn(x=0.3,0.5 wt.%;y=1,2,3 wt.%)in 3.5 wt.%NaCl solution at room temperature were investigated.Electrochemical impedance spectroscopy(EIS)plots,potentiodynamic polarization curves,and corroded surface product characterization were used to evaluate the corrosion resistance of the solders.Analysis of EIS and polarization curves shows that the corrosion resistance of the solders decreases as the In and Cu contents increase.Scanning electron microscopy,energy dispersive spectroscopy,X-ray diffraction,and X-ray photoelectron spectroscopy were applied to characterizing the corrosion product.It is found that the corrosion product is Sn_(3)O(OH)_(2)Cl_(2),which cannot play a protective role because of its loose structure.Sn−20Bi−0.3Cu−1In has the best corrosion resistance.
作者 祁达 杨文超 蒋仕伟 傅耀坤 宋浅浅 湛永钟 Da QI;Wen-chao YANG;Shi-wei JIANG;Yao-kun FU;Qian-qian SONG;Yong-zhong ZHAN(School of Resources,Environment and Materials,Guangxi University,Nanning 530004,China;State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures,Nanning 530004,China;MOE Key Laboratory of New Processing Technology for Nonferrous Metals and Materials,Nanning 530004,China)
出处 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2023年第6期1827-1838,共12页 中国有色金属学报(英文版)
基金 supported by the Guangxi Natural Science Foundation,China(Nos.2020GXNSFBA297062,2018GXNSFDA050008,2020GXNSFAA159093) the National Natural Science Foundation of China(No.51761002) the Training Plan of High-level Talents of Guangxi University,China(No.XMPZ160714)。
关键词 无铅焊料 腐蚀行为 电化学阻抗谱 极化曲线 Sn_(3)O(OH)_(2)Cl_(2) lead-free solder corrosion behavior electrochemical impedance spectroscopy polarization curve Sn_(3)O(OH)_(2)Cl_(2)
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