波长滞后法评估激光器的热阻

A method to evaluate the thermal resistance of a laser by wavelength hysteresis

封装是光电子器件的关键技术之一。同时,器件的封装还影响器件的性能。文章提出了一种基于波长滞后的方法来评估激光器在298 K至10 K环境温度范围内的热阻。通过计算降温和升温过程中波长滞后的程度来表征热阻大小。该方法解决了低温环境中无法评估激光器散热性能的问题。这对低温光互连具有重要意义,也为低温环境中激光器的封装设计提供了参考。

Packaging is one of the key technologies of optoelectronic devices.It also determines the performance of the packaged device.In the article,a method based on wavelength hysteresis is proposed to evaluate the thermal resistance of the laser at ambient temperatures from 298 K to 10 K.The thermal resistance is characterized by calculating the value of wavelength hysteresis during the cooling and heating process.This method solves the problem that the heat dissipation performance of the laser cannot be evaluated at low temperatures.This is of great significance to the optical interconnection at low temperatures.It also provides a reference for the package design of lasers in a low-temperature environment.