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Cu-Ni-Si合金连续挤压短流程制造工艺

Continuous extrusion manufacturing process with short process for Cu-Ni-Si alloy
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摘要 Cu-Ni-Si合金引线框架带材的传统生产工艺流程长、成本高、材料利用率低,且产品易产生缺陷,利用连续挤压短流程制造工艺代替传统生产工艺,探究了时效温度和时效时间对Cu-Ni-Si合金连续挤压与冷轧后的导电率、硬度、抗拉强度和伸长率的影响,确定了Cu-Ni-Si合金连续挤压与冷轧后铜带的最佳时效处理工艺为400℃×30 min,并对采用该时效处理和经70%压下率轧制后的铜带进行了研究。结果表明:铜带的硬度为252 HV、导电率为23.20 MS·m^(-1)、抗拉强度为810 MPa、伸长率为5.3%,均达到了引线框架带材所要求的技术指标,验证了该时效处理工艺的合理性和连续挤压短流程工艺制造Cu-Ni-Si合金引线框带材的可行性。 The traditional production process of Cu-Ni-Si alloy lead fram strip has long process,high cost and low material utilization rate,and the product is easy to have defects.The continuous extrusion manufacturing process with short process was used instead of the traditional production process.The influences of aging temperature and aging time on the conductivity,hardness,tensile strength and elongation of Cu-Ni-Si alloy after continuous extrusion and cold rolling were investigated,and the optimum aging process of Cu-Ni-Si alloy strip after continuous extrusion and cold rolling was determined to be 400℃for 30 min.Then,the copper strip after aging treatment at 400℃×30 min and rolling at 70%reduction rate was also studied.The results show that the hardness of copper strip is 252 HV,the conductivity is 23.20 MS·m^(-1),the tensile strength is 810 MPa and the elongation is 5.3%,which meet the requirements of lead frame strip.The suitability of the aging process and the feasibility of the Cu-Ni-Si alloy lead frame strip manufactured by continuous extrusion process with short process are verified.
作者 李明亮 林兆擎 陈中玉 朱璟 刘平 刘新宽 Li Mingliang;Lin Zhaoqin;Chen Zhongyu;Zhu Jing;Liu Ping;Liu Xinkuan(College of Automobile and Transportation,Yancheng Industrial Vocational and Technical College,Yancheng 224001,China;School of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处 《锻压技术》 CAS CSCD 北大核心 2023年第6期91-95,共5页 Forging & Stamping Technology
基金 江苏省苏北科技专项(SZ-YC2019064) 校级跨界团队基金(ygykj202103)。
关键词 CU-NI-SI合金 连续挤压 冷轧 时效 导电率 Cu-Ni-Si alloy continuous extrusion cold rolling aging conductivity
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