高导热环氧模塑料的制备

Preparation of Epoxy Molding Compound with High Thermal Conductive

介绍了导热系数大于3 W/(m·K)高导热环氧模塑料的制备。以低黏度多芳香环(MAR)环氧树脂和MAR酚醛树脂为基体,以偶联剂处理的球形氧化铝做导热填料,磷类做催化剂,经高速混合机混合、双螺杆挤出机挤出,合成高导热环氧模塑料。并研究了不同偶联剂类型对弯曲强度的影响。通过改变填充量至93%,导热系数最高可达5.6 W/(m·K),且有较好的弯曲性能和流动性能。

Preparation of epoxy molding compound(EMC) with thermal conductive greater than 3 W/(m·K) is introduced.Using multi-aromatic epoxy resin and multi-aromatic phenolic resin as matrix,and spherical alumina treated with coupling agent is used as a thermal filler and Phosphorus as a catalyst,by means of high-speed premixure and twin-screw extruder,the high thermal conductive EMC is obtained.Effects of different coupling agent on flexural strength are researched also.In addition,by adjusting the filler content to 93%,the thermal conductive could be up to 5.6 W/(m·K).Meanwhile,EMC remains good fluidity and bending properties.