期刊文献+

低温共烧陶瓷填孔工艺的改良措施

Improving Measures of Low Temperature Co-fired Ceramic Filling Process
下载PDF
导出
摘要 通过对低温共烧陶瓷(LTCC)工艺中填孔刮刀的改良,将刮刀与网版的接触棱边进行倒角,刮刀在填孔过程中受到挤压产生变形,由原来锯齿状的尖角改良成平滑的圆角,经一次填孔既改善了填孔质量,又提高了工作效率。 Through the improvement of scraping glue for hole filling in low-temperature co-fired ceramic(LTCC) process,the contact edges between the scraping glue and the screen are chamfered.The scraping glue is deformed due to compression during the hole filling process,and the original serrated sharp corners are improved into smooth rounded corners.Through one hole filling,the quality of hole filling is improved and work efficiency is improved.
作者 张英英 ZHANG Yingying(The 2^(nd) Research Institute of CETC,Taiyuan 030024,China)
出处 《电子工业专用设备》 2023年第3期37-40,54,共5页 Equipment for Electronic Products Manufacturing
关键词 低温共烧陶瓷 刮刀 倒角 改良措施 Low-temperature co-fired ceramic(LTCC) Scraping glue Chamfering Improving measures
  • 相关文献

参考文献1

二级参考文献2

共引文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部