摘要
提出了一种基于硅基晶圆级封装技术的小型化Ka频段收发前端,实现了接收通道、发射通道与本振产生电路的一体集成。该收发前端采用嵌入叠层型基片集成波导(SIW)滤波器结构实现高选择性预选滤波与低损耗垂直互连过渡的一体化设计。测试结果表明,该Ka频段滤波器中心损耗1 dB,1 dB带宽4.02 GHz,中心频偏5 GHz处抑制度优于35 dB,仿真与测试结果吻合良好。在前端模组设计中,通过采用硅基微腔屏蔽实现紧凑尺寸下各功能单元的隔离,通过采用1/4波长短路传输线结构抑制电源、控制等低频信号对接收中频的干扰,最终实现了该毫米波收发前端的小型化集成,其尺寸仅为20 mm×20 mm×1.25 mm,主要电性能满足设计要求。
A miniaturized Ka-band millimeter-wave transceiver based on wafer-level packaging technology is presented.The receiver channel,transmitter channel and local oscillator circuit are integrated together in this package.An embedded compact filter based on stacked substrate-integrated waveguide structure is employed to satisfy high selectivity frequency filtering and low loss vertical inter-connection simultaneously.Measured results show that the insertion loss is 1 dB at Ka-band center frequency;the 1 dB bandwidth is 4.02 GHz;the rejection are more than 35 dB at 5 GHz offset from center frequency.In the design of the transceiver module,the silicon-based micro-cavity is employed to achieve electro-magnetism signal isolation between different function blocks,and the millimeter-wave transmission line with 1/4 λ shorted line is adopted to suppress the intermediate frequency signal deterioration caused by power supply and control signal.The miniaturization of the millimeter-wave transceiver is achieved and the package size is 20 mm×20 mm×1.25 mm.The measured results show that the main performances of the transceiver meet the specifications of design.
作者
李智鹏
钟伟
曾荣
吕立明
赵永志
LI Zhi-peng;ZHONG Wei;ZENG Rong;LYU Li-ming;ZHAO Yong-zhi(Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;The 13th Research Institute of CETC,Shijiazhuang 050051,China)
出处
《微波学报》
CSCD
北大核心
2023年第3期55-59,共5页
Journal of Microwaves
关键词
晶圆级封装
毫米波
收发前端
基片集成波导
滤波器
wafer-level packaging
millimeter-wave
transceiver
substrate integrated waveguide
filters