有机硅凝胶离心脱泡工艺研究

Centrifugal Defoaming Process of Silicone Gel

为解决传感器类产品使用有机硅凝胶灌封时易产生气泡的问题,同时提高箭上传感器灌封效率和灌封质量,本文采用离心脱泡工艺对有机硅凝胶进行脱泡研究,采用双因素优选试验的设计方法来确定最佳离心脱泡参数范围及最优的离心脱泡工艺参数,并进行脱泡及固化效果检查。实验表明,当采用离心脱泡参数为740 r/min、12 min时,脱泡效果最佳。固化后胶液切片内的气泡最小直径约24μm,最大直径约54μm,且无桥接情况,测其绝缘均大于200 MΩ,无导通或短路情况符合NASA标准及且两个相邻气泡之间不能形成导通短路的要求。通过批量生产与试验验证,采用离心脱泡的工艺方法效果理想、稳定、有效可行,易于批量生产,满足箭上传感器类产品的使用要求。

In order to solve the problem that bubbles are easy to occur when the sensor products are filled with silicone gel,and improve the filling efficiency and quality of the sensor on the rocket,this paper adopts the centrifugal defoaming technology to study the defoaming method of silicone gel,and adopts the design method of two-factor optimization test to determine the optimal range of centrifugal defoaming parameters.After repeated tests,the optimal centrifugal defoaming process parameters were obtained,and the defoaming and curing effects were checked.The results show that 740r/min and 12min are the best centrifugal defoaming parameters for defoaming.The minimum diameter of bubbles in the solidified glue section is about 24μm,and the maximum diameter is about 54μm,and bridge is found,the resistance is greater than 200MΩ,no conduction short circuit,in line with NASA standards and no on-off short circuit between two adjacent bubbles.Through the batch production and test verification,the centrifugal defoaming process is ideal,stable,effective and feasible,for batch producion which meet the requirements of sensor products on the rocket.