等离子体技术制备高阻隔薄膜作用方式和应用现状(一)

Research Progress in Preparation of Barrier Film by Plasma Technology(Ⅰ)

近年来,在食品和药品包装、可穿戴有机电子封装、有机发光二极管(OLED)和量子点封装、真空绝缘板密封、生物医学和可再生能源防护等方面,以柔性塑料为基体的阻湿、阻氧、高透明的薄膜得到了广泛的应用,促进了阻隔膜制备技术的发展。等离子体技术在阻隔膜制备中显示出独特的优势,包括:可以大规模生产制备阻隔膜、薄膜性能优异、产品成本低廉等。这些等离子体技术包括等离子体增强物理气相沉积(PEPVD)、等离子体增强/辅助化学气相沉积(PECVD/PACVD)和等离子体增强/辅助原子层沉积(PEALD/PAALD)技术等。本文综述了基于等离子体技术制备阻隔膜的方法和理论,主要介绍等离子体源、等离子体作用方式、等离子体诊断和等离子体增强沉积阻隔膜的生长机制,以阐明等离子体参数和阻隔膜制备及性能之间的内在联系,为阻隔薄膜乃至类似柔性功能材料的制备和应用提出指导性建议。

Over the past several decades,the moisture and gas barrier films on the flexible plastic substrates have been widely used in various fields,such as food packaging,encapsulation of organic electronics,organic light-emitting diodes(OLED),sealing of vacuum insulation panels,biomedical applications and renewable energy protection.The technique of plasma has demonstrated unique characteristic and advantages to fabricate the barrier films,including the low cost,easy to scale-up and excellent film performance.The plasma techniques commonly used to prepare barrier films are plasma enhanced physical vapor deposition(PEPVD),plasma-assisted/enhanced chemical vapor deposition(PACVD/PECVD),and plasma-assisted/enhanced atomic layer deposition(PAALD/PEALD).This work mainly focus on the fabrication of barrier films via plasma-based technology.The effects of the plasma source and plasma working environment on barrier films growth will be summarized,and mechanism of plasma-enhanced coating growth in PVD,PECVD or PEALD will be discussed.