PCB镀覆孔异物堵塞不良分析

Analysis of foreign object blocking in plating holes of PCB

在印制电路板(PCB)的生产过程中,孔壁质量的可靠性一直都是重点控制项目。异物塞孔是影响孔壁质量的一种常见缺陷,在焊接过程中,孔铜受热拉伸断裂产生开路,成为不良品,该缺陷在PCB生产过程中难以被检测到,容易漏出至客户端。对异物塞孔的失效分析方法与失效案例进行研究,并总结建立有效的分析方法与步骤,从而可快速对塞孔不良进行原因分析定位,便于下一步的纠正和预防改善。

The reliability of hole wall quality has always been a key control project in the production process of printed circuit boards.Hole blocking is a common defect that affects the quality of the hole wall.This defect has a low detection rate during the production process of printed circuit boards and is prone to leakage to the client.During the welding process,the hole copper is subjected to heat stretching and fracture,resulting in an open circuit.This article mainly studies the failure analysis methods and failure cases of foreign object blocking holes,and summarizes the establishment of effective analysis methods and steps,so as to quickly analyze and locate the causes of plug hole defects and guide the next steps of correction,prevention and improvement.