高阻值密集平面电阻的失效分析

Failure analysis of high resistance dense plane resistance

埋嵌平面电阻印制电路板(PCB)使整板高密度化及微型化,具有提高系统功能可靠性、改善信号的传输及电器性能的特点。对一款埋嵌高阻值密集平面薄膜电阻的埋阻板展开研究,以采用Ohmega-ply 250Ω方阻的高阻值铜箔制作密集长电阻的电阻图案产品为例,探究其制作的工艺特点,分析密集长电阻图案的失效模式,以及影响成品电阻值波动的因素,并针对上述问题提出改善措施。结果表明:密集长电阻主要的失效模式为水平生产线的摩擦损伤,采取框架转运、控制电阻制作过程的时间及洁净度等措施,可控制阻值在要求的范围内,提升产品的制作良率。研究结果可为后续此类特种板的制作提供一定的技术参考。

Embedded planar resistance printed circuit board makes the whole board high-density and miniaturized.It has the characteristics of improving the reliability of the system function,improving the transmission of signals and the performance of electrical appliances.A resistance board embedded with high resistance dense planar film resistance is studied.For high-resistance copper foil with 250Ωsquare resistance of Ohmega-ply,the aim is to make products with dense long-resistance patterns.The process characteristics of high resistance dense buried resistance board,the failure mode of the dense long⁃resistance pattern and the factors affecting the resistance fluctuations in product are analyzed,and improvement measures are given.The results show that the main failure mode of dense long⁃resistance pattern is friction damage of horizontal production line.By taking measures such as frame transfer and controlling the time and cleanliness of the resistance making process,the resistance value can be controlled within the required range and the production yield of the product can be improved.The results can provide some technical accumulation for the subsequent production of such special boards.