双重图形拆分技术应用及国产化研究

Research on the Application and Localization of Dual Graphic Splitting Technology

本文结合某一线半导体企业双重图形拆分EDA技术国产化项目实例加以阐述。双重图形拆分技术(DPT,Double Patterning Technique),是一种通过电子设计自动化(EDA,Electronic Design Automation)软件,实现将一层芯片版图合理拆分为两层版图的技术。拆分后的芯片版图层,将通过两次光刻工艺曝光(Litho-Etch-Litho-Etch)来实现芯片在晶圆上的制造。该技术广泛应用于14 nm及更先进的半导体技术节点的芯片关键层生产。用于先进半导体制造领域的DPT,不仅需要突破光刻机单次曝光极限,也需提供更为合理的拆分解决方案,以期对后续光学临近修正、光刻工艺更为友好,最终提高芯片制造良率。

This article elaborates on the localization project of dual graphic splitting EDA technology in a frontline semiconductor enterprise.DPT(Double Pattern Technique)is a technology that can reasonably split a chip layout into two layers through Electronic design automation(Electronic Design Automation)software.The split chip layer will be exposed through two lithography processes(Litho Etch Litho Etch)to achieve chip manufacturing on the wafer.This technology is widely used in the key layer production of chips at 14 nm and more advanced semiconductor technology nodes.DPT used in the field of advanced semiconductor manufacturing not only needs to break through the single exposure limit of the Stepper,but also needs to provide a more reasonable separation solution,so as to be more friendly to the subsequent optical proximity correction,photolithography process,and ultimately improve the chip manufacturing yield.