摘要
本研究以粘度为200 mPa·S的乙烯基封端硅油,含氢硅油(1.7 mmol/g)为交联剂,以三种粒径的氢氧化铝[Al(OH)3]为导热填料和其它添加剂,制备了导热加成型有机硅材料。采用红外分析和扫描电子显微镜,Al(OH)3的表面具有强极性和颗粒形貌粗糙,采用烷基硅烷进行改性,并考察了三种不同粒径的Al(OH)3比例搭配。实验证明,Al(OH)3填充有机硅具有明显的低密度优势,密度仅为2.04 g/cm^(3),最优粉体复配比例为2:2:6,动态粘度最佳仅为142 Pa·S,兼顾高热导率3.40 W/m·k。
In this research,a thermal conductive addition-cured silicone was prepared using vinyl termi-nated silicone oil with a viscosity of 200 mPa·S,hydrogen silicone oil(1.7 mmol/g)as crosslinker,three particle sizes of aluminum hydroxide[Al(OH)3]as thermal conductive filler and other additives.By using infrared analysis and scanning electron microscopy,the surface of Al(OH)3 exhibited strong polarity and rough particle morphology.Alkylsilane was used for modification,and three different particle size Al(OH)3 ratios were investigated.Experiments have shown that Al(OH)3 filled addition-cured silicone has a significant low density advantage,be only 2.04 g/cm3.The optimal powder blending ratio is 2:2:6,and the optimized dynamic viscosity is only 142 Pa·S,while also be high thermal conductivity of 3.40 W/m·k.
作者
尹君山
亢海刚
Yin Junshan;Kang Haigang(Wacker Chemicals(China)Co.,Ltd.,Shanghai,China)
出处
《科学技术创新》
2023年第19期37-40,共4页
Scientific and Technological Innovation
关键词
低密度
氢氧化铝
导热
有机硅
low density
aluminum hydroxide
thermal conductivity
silicone
