Mo–Cu芯材表面状态对多层Cu/MoCu/Cu复合材料界面结合的影响

Effects of surface state for Mo-Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites

采用粉末冶金熔渗法制备Mo–30Cu合金板坯,Mo–30Cu板坯和无氧铜板经轧制后在30 MPa、970℃的条件下进行热压复合,制得5层铜/钼铜/铜(Cu/MoCu/Cu,CPC)复合材料。通过金相组织观察、超声波扫描分析、高温热考核、漏气率测试等方法,研究了不同Mo–30Cu芯材表面处理方式对多层CPC复合材料层间结合强度的影响。结果表明,采用拉丝处理的Mo–30Cu芯材制备的多层CPC复合材料经830℃高温烘烤10min热考核后,材料内部无空洞缺陷,漏气率小于5×10^(-3)Pa·cm^(3)·s^(-1)。采用研磨处理的Mo–30Cu芯材所制备的多层CPC复合材料经热考核后,材料出现鼓包现象,内部存在明显空洞缺陷,漏气率大于5×10^(-3)Pa·cm^(3)·s^(-1)。

Mo-30Cu alloy billets were prepared by powder metallurgy infiltration method,the rolled Mo-30Cu billets and oxygen-free copper plates were hot-pressed at 970 C with a pressure of 30 MPa to obtain 5-layer Cu/MoCu/Cu(CPC)composites.The effects of the Mo-30Cu surface treatments on the interface bonding strength of the multi-layer CPC composites were studied by the microstructure observation,ultrasonic scanning analysis,high-temperature thermal examination,and air leakage rate testing.The results show that,the multi-layer CPC composites prepared by Mo-30Cu interlayer materials treated by wiredrawing have no cavity defects after being heated at 830 C for 10 min,and the leakage rate is less than 5×10^(-3)Pa·cm^(3)·s^(-1).The multi-layer CPC composites prepared by Mo-30Cu interlayer materials treated by grinding show the bulging phenomenon after the thermal examination,have the obvious cavity defects in the interior,and the leakage rate is greater than 5×10^(-3)Pa·cm^(3)·s^(-1).