毫米波功率合成技术及三维堆叠封装

The power‑combining technology and 3D stacked package in millimeter‑wave band

为了在毫米波段内实现更大的功率输出,提出了一种毫米波功率合成技术及三维堆叠封装。基于MEMS工艺平台,设计了硅基基片集成波导功分器,在33~37 GHz实现了20 W的功率合成;利用晶圆级键合技术,将功分器和功率放大器进行三维堆叠封装,实现小型化和高密度集成,并通过实验验证了毫米波大功率合成以及三维堆叠封装的可行性。

In order to achieve greater power output in the millimeter band,a millimeter-wave power-combing technology and 3D stacked package are proposed.Based on the MEMS machining platform,a substrate integrated waveguide power divider based on silicon is designed,which achieves 20 watts of power-combing at 33~37 GHz.The power divider and power amplifier are stacked and packaged in 3D by wafer bonding technology to realize miniaturization and high density integration.The feasibility of high power-combing and 3D stacked package in the millimeter band are verified by experiments.