红外用薄形硅窗口加工工艺研究

Research on Thin Silicon Windows Processing Technology for Infrared

为了满足光电系统中降低载荷和高精度的需求,红外用大尺寸硅窗口经减薄设计后,面形精度要求相比一般红外窗口零件提高1倍,是普通薄形光学窗口零件(径厚比为10:1)的2倍以上,若仍使用常规工艺进行加工,零件精度无法满足技术指标要求。本文结合古典抛光的加工优势,针对硅单晶材料特性,优化胶合剂配比,采用胶点分布的方式粘结加工,通过改变设备主轴转速、零件加工温度等相关技术参数,以及对常规退火与精密退火的硅窗口加工对比研究,解决了红外用薄形硅窗口的加工难题。

To meet the requirements of reduced load and high precision in photoelectric systems,thin silicon infrared windows were designed by increasing the surface accuracy compared with ordinary infrared window parts,and doubling the size of ordinary thin optical window parts(diameter to thickness ratio of 10:1).If the conventional process is used for processing,the parts are unable to meet the technical specifications.This study combines the processing advantages of classical polishing with the characteristics of silicon singlecrystal materials;optimizes the adhesive ratio;adopts the adhesive point distribution method of bonding;and solves the processing problems of thin silicon infrared windows by changing relevant technical parameters,such as the spindle speed of the equipment and parts processing temperature.The processing of silicon windows by conventional and precision annealing were also compared.