一种发射组件的热设计与实现

Design and Implementation of Thermal Controlling of a Transmitting Assembly

阐述高效合理的热设计,将电子设备的工作温度控制在合理的温度区间内,这是电子设备稳定可靠运行的重要前提。针对某相控阵雷达的发射组件进行热设计及仿真分析,优化组件内元器件的传热路径。结果表明,组件内元器件的最高结温为180.66℃,组件内各器件的最高结温均满足对应要求。

This paper describes that controlling the temperature of electronic equipment in a reasonable temperature range by a rational and efficient thermal design is important for the stability and reliability of electronic equipment.In this work,thermal design and analysis of a transmitting assembly have been carried out,and the optimization of the conductive pathways of electronic components have been carried out.The optimization result shows that the maximum junction temperature of internal components is 180.66℃,and all the junction temperatures of internal components meet the derating criteria,respectively.