高频响MEMS压力传感器动态性能研究

Dynamic Performance Research of High Frequency Response MEMS Pressure Sensor

面向脉冲型风洞试验设备、大型建筑抗冲击强度试验等特殊环境对瞬态和动态力学量的重大测试需求,高频响MEMS压力传感器的研发已经受到业内广泛关注。论文从器件结构设计、性能模拟仿真、MEMS器件加工工艺及芯片动态性能测试等方面对基于SOI材料的高频响MEMS压力传感器进行了系统研究。首先,论文采用Ansys仿真软件对传感器压力敏感膜尺寸、封装结构及材料参数进行了优化设计;其次采用MEMS工艺实现压力芯片加工,并完成封装结构的制备与传感器整体装配;最后对制备的传感器进行激波管动态性能测试。测试结果表明:传感器的固有频率为222.8 kHz,上升时间约为20μs,可在74 kHz频率内安全工作,此传感器具有冲击信号响应速度快,动态响应频率高特点。

The development of high-frequency resonant MEMS pressure sensors has received wide attention in the industry for the significant testing needs of transient and dynamic mechanical quantities in special environments such as pulse-type wind tunnel test equipment and large building impact strength tests.In this paper,a systematic study of high-frequency resonant MEMS pres⁃sure sensors based on SOI materials is conducted from device structure design,performance simulation,MEMS device processing process and chip dynamic performance testing.First,this paper uses Ansys simulation software to optimize the design of the sensor pressure sensitive film size,package structure and material parameters.Second,the MEMS process is used to realize the pressure chip processing,and complete the preparation of the package structure and the overall assembly of the sensor.Finally,the prepared sensor is tested for the dynamic performance of the excitation tube.The test results show that:the intrinsic frequency of the sensor is 222.8 kHz,the rise time is about 20μs,and it can work safely within 74 kHz frequency,and this sensor has the characteristics of fast response to shock signal and high dynamic response frequency.