集成电路学科建设背景下电子封装技术专业人才培养探索与实践

Exploration and Practice of Training Talents of Electronic Packaging Technology Under the Background of Integrated Circuit Discipline Construction

电子封装是为电子电路建立互连和合适工作环境的科学和技术,是构成芯片-器件-组件-产品的桥梁。正如有人所说“一代芯片需要一代封装”,随着集成电路特征尺寸的缩小和运行速度的提高,行业对集成电路封装技术也提出了新的、更高的要求。由于电子封装的多学科交叉、尖端技术的性质,在集成电路一级学科发展的背景下,依靠综合各领域人才分别解决封装问题的模式已经不能适应技术发展的需求。综述了国内外集成电路人才的培养模式,分析了当前电子封装技术专业人才培养体系的建设与发展现状。以哈尔滨工业大学在集成电路人才培养模式上的探索实践为例,提出相关人才培养应更加注重实践环节,并与研究生课程衔接,通过产学研三位一体培养具备综合能力的高端复合型人才。

Electronic packaging is the science and technology to establish the interconnections and suitable working environments for electronic circuits,serving as a bridge of chip-device-component-product composition.As one said,“One generation of the chip needs one generation of packaging”.With the reduction of the characteristic size of integrated circuit and the improvement of the operating speed,new and higher requirements have been put forward for integrated circuit packaging technology.Due to the nature of the multi-disciplinary and cutting-edge technology of electronic packaging,the mode of integrating talents in various fields to solve packaging problems can no longer meet the needs of technological development under the background of the development of the first-level disciplines of integrated circuits.This paper reviews the training mode of integrated circuit talents at home and abroad,and analyzes the current construction and development status of the current training system for electronic packaging technology professionals.Taking Harbin Institute of Technology as an example of the exploration and practice on the cultivation mode of integrated circuit talents,it is proposed that talent training should pay more attention to the practical aspects,be connected with the postgraduate courses,and cultivate high-end compound talents with comprehensive capabilities through the trinity of industry-academia-research.