一种容性耦合隔离放大器封装结构及其封装方法研究

Study On Package Structure And Package Method Of A Capacitive Coupling Isolation Amplifier

本文基于容性耦合原理提出了一种隔离放大器封装结构及其封装方法。其基本特点:①在设计中采用塑料封装,且封装结构是双基岛隔离型引线框架,包括相互隔离的左侧基岛及右侧基岛,输入侧及输出侧芯片或片式电子元器件分别位于左侧基岛及右侧基岛区域。②芯片电容位于两个基岛的靠近区域,片式元器件及芯片电容通过键合丝连接相应电气连接点。由于芯片电容采用具有抗磁干扰能力强的材料,将两片电容互连,即可在隔离通道形成抗电磁干扰能力强的隔离势垒。③本设计将片式元器件、芯片电容和引线框架在结构上组成一个整体,使封装小型化、强功能、低成本、高可靠、易设计及制作。适用于电源、电机控制器、远程电压检测、生物医学测量、远程数据采集等领域。

Based on capacitive coupling principle,a package structure and package method of isolation amplifier are proposed in this paper,which belongs to the field of integrated circuit packaging technology.Plastic packaging is adopted in this design.In the packaging structure,the double stage isolation type lead frame includes the mutually isolated left stage and right stage,and the chip or electronic components on the input side and output side are located on the left stage and right stage area respectively.The chip capacitance is located near the two stages.Chip components and chip capacitors are connected to corresponding electrical connection points through bonding wires.Since the chip capacitors are made of materials with strong anti-magnetic interference ability,the two capacitors can be interconnected to form an isolation barrier with strong anti-electromagnetic interference ability in the isolation channel.This design consists chip components,chip capacitance and lead frame in the structure of a whole,so that the package has an advantage of miniaturization,strong function,low cost and high reliability,which is easily design and produce.The device is suitable for power supply,motor controller,remote voltage detection,biomedical measurement,remote data acquisition and other fields.