半导体厂房钢结构节点优化应用探讨

Discussion on the Application of Optimization of Steel Structure Joints in Semiconductor Factory

由于洁净半导体厂房对抗微震要求较高,因此,设计的梁柱刚度较大,需要大量采用刚接节点。但刚接节点对安装精度要求较高,洁净半导体厂房的平面尺寸较大,容易产生较大的积累误差。论文以杭州某洁净半导体厂房为研究对象,将梁柱栓焊节点优化为全焊接节点,解决了安装过程中由于厂房平面尺寸较大产生的累积误差、安装精度不足、安装困难的问题,保留了原有刚接节点形式的同时提升了构件的安装工效,节约了建设费用。

Because the clean semiconductor workshop has high requirements for resisting micro earthquakes,the designed beam column stiffness is large,and a large number ofrigidjoints are used.However,rigid joint requires high installation accuracy,while the plane size of clean semiconductor factory is large,which is easy to produce large accumulated errors.Taking a clean semiconductor factory building in Hangzhou as the research object,we optimized the bolt welded joints ofbeams and columns into fully welded joints,which solved the problems ofinsufficient installation accuracy and difficult installation caused by the accumulated errors caused by the large plane size of the factory during the installation process.While retaining the original rigid joint form,it also improved the installation efficiency ofcomponents and saved construction costs.