CCGA及CBGA封装器件加固可靠性研究

Research on The Reliability of CCGA and CBGA Package Devices

针对CCGA及CBGA封装器件的焊点可靠性问题采用ANSYS有限元模拟分析的方法,分别对器件加固前和加固后焊点的应力情况进行仿真,确认在器件的四角进行加固可以有效地降低器件焊点在温循、振动环境试验下受到的应力,且随着加固范围的扩大,焊点受到的应力值呈现变小的趋势;通过实物样件试验验证,当使用环氧胶对器件每角加固1/4长度,可以有效保证器件在温循、振动和冲击试验过程中的可靠性。

Aiming at the reliability of the solder joints of CCGA and CBGA packaged devices,ANSYS finite element simulation analysis method is used to simulate the stress of the solder joints before and after the device reinforcement.It is confirmed that strengthening at the four corners of the device can effectively reduce the stress of the solder joints under the temperature cycle and vibration environment tests.The stress value of solder joint showed a decreasing trend with the expansion of the reinforcement range.According to the sample test,when the epoxy adhesive is used to reinforce 1/4 length of each corner of the device,the reliability of the device in the process of temperature cycle,vibration and impact test can be effectively guaranteed.