新型超构表面成像光谱芯片研究进展

Research Progress of Novel Metasurface Spectral Imaging Chips

光谱成像具有良好的多维信息获取能力,广泛应用在食品安全、医学诊断、环境监测、伪装识别及军事遥感等领域。传统光谱成像系统受到分光器件的限制,其存在体积大、成本高和集成度低等问题。基于新型超构表面的成像光谱芯片可为传感器小型化、低成本提供有效解决方案。随着光谱分析需求的持续攀升,加速了超构表面成像光谱芯片的快速发展。本文综述了近年来超构表面成像光谱芯片研究进展。在此基础上,介绍了本团队最新研究成果,通过创新设计成像光谱芯片体系架构,可同时实现高能量利用率、高空间分辨率、高光谱分辨率,为芯片级光谱成像系统的应用打下良好的基础。最后论述了成像光谱芯片的发展趋势及应用前景,为实现光谱成像系统小型化提供参考。

Spectral imaging has been widely used in food safety,medical diagnosis,environmental monitoring,camouflage identification,and military remote sensing because of its excellent multidimensional information acquisition capability.Traditional spectral imaging systems are limited by spectroscopic components,suffering from problems such as large sizes,high costs,and low integration.Novel metasurface-based spectral imaging chips can provide an effective solution for obtaining miniaturized and low-cost sensors.With the continuous increase in demand for spectral analysis,the development of metasurface spectral imaging chips has accelerated.We review the recent research progress of metasurface spectral imaging chips.On this basis,we present the latest research results of our team.Through the innovative design of the imaging spectral chip system architecture,a high energy utilization rate,spatial resolution,and spectral resolution can be achieved simultaneously,providing a solid foundation for the application of chip-level spectral imaging systems.Finally,we discuss the development trend and application prospects of spectral imaging chips,providing a reference for the miniaturization of the spectral imaging system.