具有散热结构的晶圆级扇出封装电路热阻研究

Research on Thermal Resistance of Wafer-level Fan-out Package Circuit with Heat Dissipation Structure

为了改善芯片的散热状况,提高微系统的工作效率,对晶圆级扇出封装电路的传热性能展开了研究。发现粘接散热片能够将封装电路的表观热阻降低28.43%,大大地提高封装电路的运行速率。同时,热学仿真表明,添加散热片后,封装电路的计算热阻大幅下降。通过对比分析实验结果与仿真结果发现,散热片与芯片之间的粘结情况直接影响散热片的作用效果,粘接区域的空洞会使得测试结果与仿真结果存在较大偏差。

In order to improve chip heat dissipation and the efficiency of microsystem,the heat transfer performance of wafer-level fan-out encapsulated circuits is investigated.It is found that bonding a heat sink can reduce the apparent thermal resistance of the packaged circuit by 28.43%,which greatly improves the operation rate of the packaged circuit.At the same time,thermal simulation shows that the calculated thermal resistance of the package circuit is greatly reduced after adding the heat sink.By comparing the experimental results and simulation results,it is found that the bonding between the heatsink and the chip directly affects the effect of the heatsink,and voids in the bonding area can make the test results deviate significantly from the simulation results.