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跨接片激光软钎焊工艺技术研究

Research on Laser Soldering Technique for the Jumper
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摘要 跨接片能够解决异质材料热失配的问题,因此被广泛地应用于微波组件中射频信号的连续传输。针对微波组件用跨接片激光软钎焊工艺开展研究,优化了焊膏涂覆方式和激光焊接的工艺流程,对比分析了跨接片激光软钎焊和手工焊接的焊点力学性能及微观组织,并开展了温度循环试验。结果表明:相比跨接片手工焊接的方式,激光焊接的焊点剪切力平均值更大、标准差更小;从微观组织可以看出跨接片采用激光软钎焊焊点的金属间化合物厚度均匀且连续,符合标准要求。按照某型雷达产品环境应力筛选规范开展跨接片温度循环加严试验,试验后焊点无缺陷,符合产品要求。 The jumper can solve the problem of thermal mismatch of heterogeneous materials,so it is widely used in the continuous transmission of RF signals in microwave components.The laser soft brazing process of the jumper for microwave components is studied.The solder poste coating method and laser welding process are optimized.The mechanical properties and microstructure of solder joints of jumper between laser brazing and manual welding are compared and analyzed.And temperature cycle tests are carried out.The results show that compared with the manual welding method of jumper,the mean value of shear force of laser welding joints is larger and the standard deviation is smaller.And it can be seen from the microstructure that the thickness of the intermetallic compounds in the solder joints of laser soldering is uniform and continuous,which meets the standard requirements.According to the environmental stress screening standard of a radar product,the temperature cycle tightening test of the jumper is carried out.After the test,the solder joint has no defects and meets the requirements of the product.
作者 林元载 蒋庆磊 肖奕楼 刘小铭 LIN Yuanzai;JIANG Qinglei;XIAO Yilou;LIU Xiaoming(The 14th Research Institute of China Electronics Technology Corporation,Nanjing 210039,China)
出处 《电子质量》 2023年第7期56-61,共6页 Electronics Quality
关键词 微波组件 跨接片 激光软钎焊 微观组织 microwave module jumper laser soldering microstructure
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