低介电损耗高力学强度氟树脂膜及其柔性覆铜板的制备研究

Preparation of fluororesin-based film with low dielectric loss and high mechanical strength and its copper clad laminate

以可熔性聚四氟乙烯(PFA)为基体树脂,首先用聚合物和无机填料对树脂进行共混改性和填充改性,配置悬浮液;然后将悬浮液依次经过涂布和烧结,制备氟树脂基膜;最后将氟树脂基膜与铜箔一起压合制备柔性覆铜板(FC‐CL)。结果表明:制备得到的FCCL介电损耗为0.0015(10 GHz),抗张强度为38 MPa,吸水率为0.05%,耐锡焊性测试中(300℃,10 s,3次)无分层、氧化、起泡现象,剥离强度大于1.0 kgf/cm,具有较佳的综合性能。

The meltable polytetrafluoroethylene(PFA)was used as the matrix resin.Firstly,the PFA resin was modified by blending and filling with polymer and inorganic fillers to prepare suspension.Then,the suspension was coated and sintered in turn to prepare fluororesin-based film.Finally,the fluororesin-based film and copper foil were pressed together to prepare flexible copper clad laminate(FCCL).The results show that the prepared FCCL has 0.0015(10 GHz)of dielectric loss,38 MPa of tensile strength,0.05%of water absorption rate,greater than 1.0 kgf/cm of peel strength,and there is no delamination,oxidation,foaming in the soldering resistance test(300℃,10 s,3 times),which indicates that the FCCL has better overall performance.