二聚酸型聚酰胺热熔胶的制备及其性能研究

Study on preparation and properties of dimeric acid polyamide hot melt adhesive

首先以二聚酸、乙二胺和己二胺为原料,分别合成二聚酸-乙二胺型聚酰胺热熔胶和二聚酸-己二胺型聚酰胺热熔胶。然后用聚醚二胺替代部分二元胺,再用己二酸替代部分二聚酸,通过共聚合成了改性的聚酰胺热熔胶。研究了聚醚二胺和己二酸的物质的量对聚酰胺热熔胶性能的影响。研究结果表明:(1)随聚醚二胺含量的增加,聚酰胺热熔胶的玻璃化转变温度(T_(g))、硬度和拉伸强度降低;拉伸剪切强度先上升后下降,当聚醚二胺含量为20%时,拉伸剪切强度达到最大值4.2 MPa。(2)当m(二元酸)∶m(乙二胺或己二胺)∶m(聚醚二胺)=10∶6∶4时,在二元酸中掺入部分己二酸,随着己二酸含量的增加,聚酰胺热熔胶的T_(g)、硬度、拉伸强度和拉伸剪切强度增加。在己二酸含量为40%时,拉伸剪切强度最大值为4.2 MPa,T_(g)最大值为170.5℃。(3)在聚醚二胺含量为40%、己二酸含量相同时,二聚酸-乙二胺型聚酰胺热熔胶的T_(g)、硬度、拉伸强度和拉伸剪切强度均高于二聚酸-己二胺型聚酰胺热熔胶的性能。

Firstly,dimeric acid-ethylenediamine polyamide hot melt adhesive and dimeric acidhexamethylenediamine polyamide hot melt adhesive were synthesized,respectively from dimeric acid,ethylenediamine and hexamethylenediamine.The modified polyamide hot melt adhesive was synthesized by copolymerization of polyether diamine instead of partial diamine and adipic acid instead of partial dimeric acid.The effects of the amount of polyether diamine and adipic acid on the properties of polyamide hot melt adhesive were investigated.The research results showed that,(1)The glass transition temperature(T_(g)),hardness and tensile strength of polyamide hot melt adhesive decreased with the increase of polyether diamine content.The tensile shear strength first increased and then decreased.When the content of polyether diamine was 20%,the tensile shear strength reached the maximum of 4.2 MPa.(2)When m(dicarboxylic acid):m(ethylenediamine or hexamethylenediamine):m(polyether diamine)=10:6:4,part of adipic acid was added into the dicarboxylic acid.With the increase of adipic acid content,the T_(g),hardness,tensile strength and tensile shear strength of polyamide hot melt adhesive increased.When the content of adipic acid was 40%,the maximum tensile shear strength was 4.2 MPa,and the maximum T_(g) was 170.5℃(.3)When the content of polyether diamine was 40%and the content of adipic acid was the same,the T_(g),hardness,tensile strength and tensile shear strength of dimeric acid-ethylenediamine polyamide hot melt adhesive were all higher than those of dimeric acid-hexamethylenediamine polyamide hot melt adhesive.