LED显示屏灌封用导热胶研制

Preparation of thermal conductive encapsulation for LED display

以α,ω-二羟基聚二甲基硅氧烷为基胶,配合导热填料、稀释剂、交联剂和增粘剂等,制备了LED显示屏灌封用导热胶。研究了导热填料和交联剂用量对导热胶性能的影响,探讨了增粘剂种类和用量对导热胶粘接性能、力学性能的影响以及稀释剂用量对出油情况的影响。结果表明:随着导热填料用量增大,导热胶的拉伸强度、黏度、导热系数和密度都增大,断裂伸长率先增大后减小;随交联剂用量增大,导热胶的拉伸强度和硬度增大,断裂伸长率减小;含氨基的增粘剂对LED显示屏粘接良好,链烷烃混合物稀释效果好且不发生出油问题。

The thermal conductive encapsulation for LED display was prepared withα,ω-dihydroxy polydimethylsiloxane as the basic resin and other processing aids such as thermal conductive filler,thinner,cross-linker,and tackifier,etc.The influences of conductive filler and cross-linker amount on the properties of thermal conductive encapsulation were investigated.The influence of tackifier sort and amount on bonding strength and mechanical property of thermal conductive encapsulation was discussed.The influence of thinner on the oil seepage was investigated.The results show that the tensile strength,hardness,thermal conductivity,density of the thermal conductive encapsulation decrease,and the elongation decreases at first and then increases as the amount of thermal conductive filler increases.The tensile strength and hardness increase,and the elongation decreases as the amount of cross-linker increases.The tackifier with amino has good bonding performance to LED display.The alkane thinner is good to diluted effect,and no oil seepage.