1Raymond L Brown,Paul W Polinski. Manufacturing of microwave modules using low-temperature Co-fired ceramics[A].1994.1727-1730.
2Christian Block,Peter Hagn,Christian Hoffmann. LTCC technology for system in package solutions[A].2006.18-20.
3Schmuckle F J,Jentzsch A,Heinrich W. Spinnler LTCC as MCM substrate:design of strip-line structures and flip-chip interconnects[A].2001.1903-1906.
4Bonnet B,Monfraix P,Chiniard R. 3D packaging technology for integrated antenna front-ends[A].2008.1569-1572.
5Rainee N Simons. Coplanar Waveguide Circuits,Components and Systems[M].New York:Wiley Inter-science,2001.1-3.
6Raymond L Brown, Paul W. Polinski Manufacturing of Microwave Modules using Low-temperature Co-fired Ceramics [J]. IEEE MTToS Digest 1994:1727-1730.
7Christian Block, Peter Hagn, Christian Hoffmann, et alLTCC Technology for System in Package Solutions [J]. Silicon Monolithic Integrated Circuits in RF Systems, 2006, Digest of Papers. 2006:18-20.
8F J Schmuckle, A Jentzsch, W Heinrich, J Butz, M. Spinnler LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects [J]. 2001 IEEE MTT-S Digest, 2001:1903-1906.
9Bonnet B, et al. 3D packaging technology for integrated antenna front-ends[C].38'h European Microwave Conference, 2008: 1569-1572.
10Rainee N simons. Coplanar Waveguide Circuits, Components and Systems[M]. New York: Wiley inter- science, 2001.1-3.
